Category: UV/Thermal Release Film Tape

UV Tape and Thermal Release Tape for Microchip Processing

In the manufacturing process of semiconductors, weather they are silicone, SiC, GaAs, GaN, or somethings ceramic for wave-generating components, bonding and fixation are essential for slicing, etching and back grinding process in order to protect those chips and realise seamingless production. Fonitaniya’s UV tape and thermal release tape have strong bonding capability,which in converse, are easily removed after UV-irradiation or thermal exposure for a non-residue surface of the material. Based on Polyolefin or Polyester, our UV Tape and Thermal Release Tape guarantee excellent chemical and thermal resistance.