Die Attatch Film with Dicing Tape
- Combines dicing and die attach functions for high reliability.
- Optimized for semiconductor assembly processes, including BOC and CSP.
- Outstanding pick-up performance for 50 µm chips.
- Integrated with UV-sensitive pressure dicing tape for ease of use.
Attributes of UV-curable Dicing Die Attach Tape
| Attribute | FON-10129-1 | FON-10129-2 | FON-10129-3 |
|---|---|---|---|
| Brand | Fonitaniya | Fonitaniya | Fonitaniya |
| Serial Number | FON-10129-1 | FON-10129-2 | FON-10129-3 |
| DAF Thickness (µm) | 20/25/50 | 10 | 50/60/80 |
| General DC Tape Type | UV Type | UV Type | UV Type |
| DC Tape Thickness (µm) | 100 | 100 | 100 |
| Recommended UV Dosage (mJ/cm²) | 200 | 200 | 200 |
| Curing Condition | 150°C, 60 min or 180°C, 60 min | 150°C, 60 min | 150°C, 60 min or 120°C, 60 min (Half Cure) |
| Ramp Up Time to Curing Temperature | 30 min | 30 min | 30 min |
| CTE α1 (ppm/K) | 37 | 33 | 26 |
| CTE α2 (ppm/K) | 132 | 125 | 80 |
| Tg (TMA) (°C) | 115 | 120 | 156 |
| Melting Viscosity @70°C (Pa·s) | 37,400 | 25,000 | 16,000 |
| Melting Viscosity @120°C (Pa·s) | 2,000 | 1,350 | 1,600 |
| Elastic Modulus @50°C (MPa) | 2,900 | 4,500 | 6,000 |
| Elastic Modulus @250°C (MPa) | 56 | 100 | 650 |
| Water Absorption (85°C, 85%, 100h, wt%) | 0.8 | 0.8 | 0.7 |
| Die Shear Strength @Room Temperature (MPa) | 60 | 60 | 50 |
| Die Shear Strength @260°C (MPa) | 12 | 12 | 16 |
Die Attach Film with Dicing Tape
The Die Attach Film with Dicing Tape is an advanced adhesive solution tailored for semiconductor manufacturing processes. It integrates dicing and die attach functions, solving issues like silver paste bleeding and ensuring reliable chip-to-lead frame or interposer bonding. This product is ideal for applications like BOC and stacked CSP manufacturing, offering a significant boost in adhesive reliability.
The film is designed to be released using both UV exposure and thermal processes, depending on the specific application. UV release ensures precise detachment for delicate operations, while thermal release provides flexibility for high-temperature manufacturing workflows. To use, apply the tape to the wafer surface, complete dicing or die attachment, and release using the appropriate method (UV dosage or curing temperature) as per process requirements.
Application
Ideal for semiconductor die attachment and dicing processes in BOC and CSP manufacturing.
If you want to customize tapes of other specifications, you can contact us to customize the specifications you want.
When can I get my quotation?
We will provide you with a detailed quotation as soon as we receive your inquiry. Typically, we will send you a quote within 24 hours. If your requirements are complex or need custom services, it might take a bit longer, but we will keep you informed of the progress promptly.
What is your order schedule?
After confirming your order, we will schedule production based on your requirements and our production plan. Generally, the production cycle for standard orders is 2-3 weeks. If you have an urgent order, please contact us as soon as possible. We will do our best to accommodate your request and arrange expedited production.
Can I get samples?
Yes, we are happy to provide samples for you. Please contact our sales team with your specific needs and sample type, and we will arrange for the samples to be sent to you as soon as possible. Some samples may require a small fee, but in most cases, we offer free samples for testing and evaluation.
Can I print my logo on the tape?
Absolutely. We offer customization services and can print your logo on the tape according to your requirements. Please provide a high-quality logo file and specific printing requirements. Our design team will create a draft design for your approval. We will also provide samples for you to confirm before production.
What if I don't have detailed requirements?
If you are unsure about the specific requirements, our technical team is more than happy to offer professional advice. Just tell us your application scenario and basic needs, and we will recommend the most suitable tape solution based on our extensive experience and wide range of products. We can also provide sample testing to ensure our products meet your needs.
